Made from high-performance epoxy resin with excellent bonding strength. Suitable for bonding metals (e.g., steel, aluminum) and non-metals (e.g., epoxy boards/fiberglass).

Specifications

Main component	Component A: Epoxy; Component B: Amine
Viscosity @ 23°C	Component A: 20,000–40,000 cps; Component B: 6,000–14,000 cps
Colour (before curing)	Component A: Milky white; Component B: Milky white or amber
Density (g/cm³)	Component A: 1.11–1.16; Component B: 1.05–1.10
Mixing ratio (A:B)	Volume 2:1; Weight 2:0.96
Working time @ 23°C (10 g mixed)	Approx. 60 minutes
Colour (after curing)	Off-white
Shore D hardness	75–80
Coefficient of thermal expansion (in./in./°C)	Below Tg: 53 × 10⁻⁶; Above Tg: 206 × 10⁻⁶
Dielectric strength (ASTM D 149)	37.06 kV/mm
Volume resistivity (ASTM D 257)	2.5 × 10¹⁵ Ω cm
Shear strength (23°C × 7d)	27 MPa
Storage	Cool, dry place (5–30°C)
Shelf life	12 months
Packaging	50 ml/tube; 400 ml/tube

Data is based on laboratory conditions. Users should test and analyze based on their specific environments.

How to use

• Apply at room temperature (18–30°C).
• Clean and treat the bonding surfaces beforehand.
• Remove excess adhesive before curing.

Typical applications

• LED lighting
• Consumer electronics
• Automotive electronics
• Medical electronics